Frequently Asked Questions
PCB Design Services
We usually charge on a per-project basis, depending on circuit complexity, layer count, interface requirements, and deliverables. Free initial evaluation is supported before formal quotation.
Yes, we support remote communication via Zoom, Teams, WhatsApp, WeChat, or Email. An experienced English-speaking engineer will be assigned to ensure smooth and efficient collaboration.
We are capable of handling a wide range of complex design projects, including:
- High-speed design (DDR4, PCIe, HDMI, etc.)
- HDI routing
- Power and Signal Integrity (PI/SI) analysis
- EMC/EMI optimization
- Flex and rigid-flex PCB design
Yes. We embed DFM and DFT checks throughout the design, including trace width, via size, test point placement, and pad geometry to ensure manufacturability and testability.
Yes. We provide end-to-end design services including schematic creation, prototype planning, PCB layout, DRC checking, and final Gerber generation.
Yes. We can optimize existing files, perform structure and DFM checks, or assist in prototyping and preparing for mass production.
Yes, we offer advanced support such as:
- Power & signal integrity simulation
- Thermal distribution and power loss analysis
- Stack-up optimization with impedance modeling
Our minimum trace/space is 3mil/3mil. For HDI, we support 0.1mm micro vias and stacked via structures up to 3-level HDI.
We use Polar Si9000 for impedance modeling and deliver ±10% controlled results with documented reports for manufacturer confirmation.
We use automatic length tuning (accordion routing) to ensure differential pair matching within ±5mil accuracy in Altium/Allegro.
PCB Reverse Engineering Services
Yes, our reverse engineering service can deliver the following:
- Complete schematic diagram
- Gerber files in multiple standard formats
- Accurate BOM (including footprint, parameters, and part numbers)
- PCB stack-up diagram (layer structure, materials, copper weight)
Yes. We are fully capable of reverse engineering complex multilayer PCBs (6+ layers), HDI boards, and BGA packages using X-Ray inspection and layered modeling to recover buried/blind vias and internal routing.
Yes, we use a three-step process:
- Physical board disassembly and layer-by-layer scanning
- Manual verification of circuitry and logical flow
- Reconstruction using professional EDA software (e.g., Altium, OrCAD)
Yes. We can complete reverse engineering based solely on:
- Physical PCB sample (preferred; shipping accepted)
- High-resolution front and back photos
- Partial schematics, datasheets, or block diagrams (if available)
Yes. We are equipped with:
- Industrial-grade microscopes for inspecting BGA and fine-pitch components
- X-Ray imaging for internal layer and hidden joint inspection
- LCR meters for identifying unmarked resistors, capacitors, and inductors
Our standard turnaround time for 4–6 layer PCBs is 7–10 business days. For complex multilayer or BGA designs, the lead time is 10–15 business days. Expedited service (3–5 days) is available depending on the complexity of the project.
Absolutely. We provide one-stop solutions from reverse engineering to PCB prototyping, SMT assembly, and small-batch production to accelerate product verification and go-to-market.
We use X-ray inspection and cross-sectional grinding to analyze multilayer connectivity, then reconstruct inner traces based on logical inference and known BGA patterns.
Yes. We not only reconstruct the netlist but also generate logical schematics with organized functional blocks and signal naming conventions.
We use laser scanning and chemical stripping to remove solder mask and capture high-res images. Warp correction is applied to ensure layer alignment accuracy.
IC Decrypty
We mainly support decryption and data extraction for standard MCUs (8-bit/16-bit/32-bit), EEPROM, FLASH memories, and certain programmable devices. For custom or highly encrypted ICs, we first conduct a feasibility evaluation.
Deliverables usually include:
Extracted firmware or program code (Bin/Hex file format)
Partial functional descriptions of the IC (if retrievable)
Read-out and verification report
Some decryption methods involve physical-level operations, which may carry a risk of chip damage. We usually require 2–3 identical samples as backups. Non-destructive tests are performed first to maximize success rates.
For standard MCUs or memory devices, the lead time is 5–7 business days. Complex or high-security ICs may take longer. Expedited service (3–5 days) is available depending on IC type.
Yes. Based on the decrypted firmware or logic data, we can support:
Secondary development and functional optimization
Substitution with alternative domestic or international ICs
Reverse BOM generation and redesign for replacement parts
We strictly follow the client’s local laws and regulations, and only accept projects with legitimate authorization or compliance purposes (e.g., after-sales repair, discontinued parts replacement, R&D). NDAs are signed for all projects to ensure compliance and confidentiality.
Yes. We provide one-stop service from decryption → firmware programming → PCB prototyping → SMT assembly → batch production, enabling fast validation and manufacturing integration.
All decrypted data and client files are stored in encrypted servers with restricted access. After project completion, data is delivered only through client-approved secure channels.